Model Number: bga tool T-890-1
Key Specifications/Special Features:
Has the strong and perfect function selectionWith eight temperature waves in the memory softwareCan select the right temperature wave according to thesolder/unsolder requestIntelligent temperature wave heatingCan achieve the solder/unsolder automaticallyWith three-dimensional adjustable lamp bodyUses laser lightSuitable for unsoldering any-angle components
PID intelligent temperature control can avoid the IC damage dueto the fast or uninterrupted warming up
Has a super hot melt system
Used infrared welding technology which is developedindependently
Heat is easy to pierce and distribute evenly
Can suit for a variety of computer, notebook, PlayStation's BGAcomponents, especially in a north/south bridge chipset ofcomputer
Friendly human-machine operation interface
Perfect LCD display
Can watch the whole repairing process very clearly
Ergonomic design, practical and easily operated
Good build quality but at the same time lightweight and a smallfootprint allows the T-890 to be easily bench positioned,transported or stored
Shipping Information:
- FOB Port: Qingdao
- Lead Time: 1 - 10 days
Main Export Markets:
- Asia
- Australasia
- Eastern Europe
- North America
Download more information about this product
Any third-party trademarks shown here are for reference purposes only. We are not authorized to sell any items bearing such trademarks.